Light emitting device and method of manufacturing the same

ABSTRACT

A light emitting device includes: a light emitting element; a wavelength conversion member including: a wavelength conversion portion arranged on or above an upper surface of the light emitting element, and a light-transmissive portion, wherein, in a plan view, the light-transmissive portion surrounds at least one or more lateral surfaces of the wavelength conversion portion; a sealing member comprising a lens portion that is arranged on or above an upper surface of the wavelength conversion member; and a light reflection member that surrounds one or more lateral surfaces of the wavelength conversion member. In a plan view, the wavelength conversion member is inside a perimeter of the lens portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 16/543,454, filed on Aug. 16, 2019, which claims priority under35 U.S.C. § 119 to Japanese Patent Application No. 2019-012949, filed onJan. 29, 2019, and Japanese Patent Application No. 2018-179935, filed onSep. 26, 2018, the contents of which are incorporated herein byreference in their entireties.

BACKGROUND

The present disclosure relates to a light emitting device, and a methodfor manufacturing the light emitting device.

Light emitting devices are known that include a light emitting elementtogether with a phosphor to emit mixed color light. Such light emittingdevices are used for lighting fixtures and liquid crystal displaybacklights.

For example, a light emitting device is known that includes a lightemitting element for emitting blue light, and a phosphor for emittingyellow light.

In such a light emitting device, its chromaticity will vary inaccordance with viewer's angle, in other words, so-called colorunevenness will occur. In order to reduce color unevenness, alight-diffusing material can be mixed in a phosphor layer that includesa phosphor.

Because the light-diffusing material will evenly diffuse light, thislight emitting device can be expected to have reduced color unevennessin light distribution (see Japanese Patent Publication No. JP2018-49875).

SUMMARY

However, the light-diffusing material not only diffuses but also absorbslight. Such absorption causes loss of light. As a result, the luminousflux of the light emitting device will decrease. Hence, there is a needof a light source that has improved color unevenness without reducingits luminous flux.

Therefore, it is an object of certain embodiments of the presentinvention to provide a light emitting device that has improved colorunevenness but suppresses luminous flux reduction.

A light emitting device according to one aspect of the present inventionincludes a support member, a light emitting element, a wavelengthconversion member, a light reflection member, and a light-transmissivemember. The light emitting element is mounted on the support member. Thewavelength conversion member is arranged on or above the light emittingelement, and larger than the light emitting element as viewed in a planview. The wavelength conversion member includes a wavelength conversionportion arranged on or above the light emitting element, and alight-transmissive portion that is arranged around the wavelengthconversion portion. The light reflection member is spaced away from theside surfaces of the wavelength conversion member and the light emittingelement and arranged on or above the support member. Thelight-transmissive member is arranged between the light reflectionmember and the side surface(s) of the light emitting element, and is incontact with a part of the light-transmissive portion of the wavelengthconversion member and the side surface(s) of the light emitting element.

A method for manufacturing a light emitting device according to anotheraspect of the present invention includes a wavelength conversion memberpreparation step, a wavelength conversion member arrangement step, alight-transmissive member arrangement step, and a light reflectionmember arrangement step. The light emitting device includes a supportmember, a light emitting element, a wavelength conversion member, and alight reflection member. The light emitting element is mounted on thesupport member. The wavelength conversion member is arranged on or abovethe light emitting element, and is larger than the light emittingelement as viewed in a plan view. The light reflection member isarranged on or above the support member. In the wavelength conversionmember preparation step, the wavelength conversion member is preparedthat includes a wavelength conversion portion that includes a phosphor,and a light-transmissive portion that is arranged around the wavelengthconversion portion. In the wavelength conversion member arrangementstep, the wavelength conversion member is arranged on or above the lightemitting element that is mounted on the support member. In thelight-transmissive member arrangement step, a light-transmissive memberis arranged on or above the support member so as to cover a part of thelight-transmissive portion and the side surface(s) of the light emittingelement. In the light reflection member arrangement step, the lightreflection member is arranged on or above the support member so as tocover the side surfaces of the wavelength conversion member and thelight-transmissive member.

According to certain embodiments of the present disclosure, a lightemitting device can be provided that has improved color unevenness butsuppresses luminous flux reduction.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, in which:

FIG. 1 is a perspective view showing a light emitting device accordingto a first embodiment of the present invention;

FIG. 2 is a plan view showing a light emitting device according to thefirst embodiment of the present invention;

FIG. 3 is a plan view showing the light emitting device of FIG. 2 withlower members being shown by dashed lines;

FIG. 4 is an exploded perspective view showing the light emitting deviceshown in FIG. 1 ;

FIG. 5 is an exploded perspective view showing the light emitting deviceshown in FIG. 1 as viewed from the bottom side;

FIG. 6 is a cross-sectional view showing the light emitting device shownin FIG. 1 taken along the line VI-VI;

FIG. 7 is a cross-sectional view schematically showing the travellingdirections of light in the view of FIG. 6 ;

FIG. 8 shows an image showing the light emission of a light emittingdevice according to a comparative example;

FIG. 9 shows an image showing the light emission of the light emittingdevice according to the first embodiment;

FIG. 10 is a plan view showing a light emitting device according to amodified embodiment;

FIG. 11 is a plan view showing a light emitting device according toanother modified embodiment;

FIG. 12 is a perspective view showing a light emitting device accordingto a second embodiment with its sealing member being removed;

FIG. 13 is an exploded perspective view showing the light emittingdevice shown in FIG. 12 ;

FIG. 14 is a cross-sectional view showing the light emitting deviceaccording to the second embodiment;

FIG. 15 is a cross-sectional view showing a light emitting deviceaccording to a third embodiment;

FIG. 16 is a cross-sectional view showing one process of a method formanufacturing the light emitting device according to the firstembodiment;

FIG. 17 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the firstembodiment;

FIG. 18 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the firstembodiment;

FIG. 19 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the firstembodiment;

FIG. 20 is a cross-sectional view showing still another process of themethod for manufacturing the light emitting device according to thefirst embodiment;

FIG. 21 is a cross-sectional view showing one process of a method formanufacturing the light emitting device according to the thirdembodiment;

FIG. 22 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the thirdembodiment;

FIG. 23 is a perspective view showing a light-transmissive resinmaterial sheet with openings being formed;

FIG. 24 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the thirdembodiment;

FIG. 25 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the thirdembodiment;

FIG. 26 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the thirdembodiment;

FIG. 27 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the thirdembodiment;

FIG. 28 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the thirdembodiment;

FIG. 29 is a cross-sectional view showing still another process of themethod for manufacturing the light emitting device according to thethird embodiment;

FIG. 30 is a plan view showing the light emitting device according tothe third embodiment;

FIG. 31 is a cross-sectional view showing one process of a method formanufacturing a light emitting device according to a fourth embodiment;

FIG. 32 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the fourthembodiment;

FIG. 33 is a perspective view showing a phosphor-containing resinmaterial sheet that has grooves formed on its surface;

FIG. 34 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the fourthembodiment;

FIG. 35 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the fourthembodiment;

FIG. 36 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the fourthembodiment;

FIG. 37 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the fourthembodiment;

FIG. 38 is a cross-sectional view showing another process of the methodfor manufacturing the light emitting device according to the fourthembodiment;

FIG. 39 is a cross-sectional view showing still another process of themethod for manufacturing the light emitting device according to thefourth embodiment; and

FIG. 40 is a plan view showing the light emitting device according tothe fourth embodiment.

DETAILED DESCRIPTION

Embodiments will now be described with reference to the accompanyingdrawings, wherein like reference numerals designate corresponding oridentical elements throughout the various drawings.

A light emitting device according to an embodiment of the presentinvention includes a support member, a light emitting element, and awavelength conversion member, a light reflection member. The lightemitting element is mounted on the support member. The wavelengthconversion member is arranged on or above the light emitting element,and is larger than the light emitting element as viewed in a plan view.The light reflection member is spaced away from the side surfaces of thewavelength conversion member and the light emitting element, and isarranged on or above the support member. The wavelength conversionmember includes a wavelength conversion portion arranged on or above theupper surface of the light emitting element, and a light-transmissiveportion that is arranged around the wavelength conversion portion. Thelight emitting device further includes a light-transmissive member thatis arranged between the light reflection member and the side surface(s)of the light emitting element, and is in contact with a part of thelight-transmissive portion of the wavelength conversion member and theside surface(s) of the light emitting element.

According to this arrangement, a space is formed that extends from theside surface(s) of the light emitting element to the side surfaces ofthe wavelength conversion portion, and is occupied by thelight-transmissive member and the light-transmissive portion of thewavelength conversion member so that light emitted by the light emittingelement can pass through the light-transmissive member and thelight-transmissive portion without its wavelength being converted by thewavelength conversion portion. As a result, color unevenness on theperiphery of the wavelength conversion portion can be reduced that hasbeen a problem in conventional light emitting devices including such awavelength conversion portion. Because the color unevenness can bereduced based on the principle that does not use diffusion, luminousflux reduction can be prevented. Therefore, the color unevenness can beimproved without luminous flux reduction.

According to a light emitting device of another embodiment of thepresent invention, it is preferable that the light-transmissive memberincludes a light-transmissive bonding member that is interposed betweenthe light emitting element and the wavelength conversion member, andthat a part of the light-transmissive bonding member extends from aninterface between the light emitting element and the wavelengthconversion member to the peripheral part defined by the side surface(s)of the light emitting element and a main surface of the wavelengthconversion member that is located on the light emitting element side.The part of the light-transmissive bonding member that extends from theinterface is in contact with the part of the light-transmissive portion.According to this arrangement, because the light-transmissive memberalso serves as the bonding member, the number of components can bereduced.

According to a light emitting device of another embodiment of thepresent invention, the light-transmissive bonding member can have aroughly inverted triangular shape that expands toward thelight-transmissive portion as viewed in a cross-sectional side view. Inthis arrangement, an inclined surface(s) can be provided by such aroughly inverted triangular shape. The inclined surface can reflectlight emitted by the light emitting element.

According to a light emitting device of another embodiment of thepresent invention, a sealing member can further be included thatincludes a hemispherical lens portion and a flange portion. Thehemispherical lens portion is arranged on or above the upper surface ofthe wavelength conversion member, and has a circular shape as viewed ina plan view and a semicircular shape as viewed in a cross-sectionalview. The flange portion protrudes from the outer periphery of the lensportion.

According to a light emitting device of another embodiment of thepresent invention, the wavelength conversion member can have acylindrical shape. In this arrangement, the color unevenness can beimproved.

According to a light emitting device of another embodiment of thepresent invention, the light-transmissive portion can be arranged on theside and the upper surfaces of the wavelength conversion portion, andthe light-transmissive portion can form the upper surface part of thewavelength conversion member.

According to a light emitting device of another embodiment of thepresent invention, the upper surface of the wavelength conversion membercan include the upper surfaces of the wavelength conversion portion andthe light-transmissive portion that is arranged around the wavelengthconversion portion.

A method for manufacturing a light emitting device according to anembodiment of the present invention includes a wavelength conversionmember preparation step, a wavelength conversion member arrangementstep, a light-transmissive member arrangement step, and a lightreflection member arrangement step. The light emitting device includes asupport member, a light emitting element, a wavelength conversionmember, and a light reflection member. The light emitting element ismounted on the support member. The wavelength conversion member isarranged on or above the light emitting element, and is larger than thelight emitting element as viewed in a plan view. The light reflectionmember is arranged on or above the support member. In the wavelengthconversion member preparation step, the wavelength conversion membermaterial is prepared that includes a wavelength conversion portion thatincludes a phosphor, and a light-transmissive portion that is arrangedaround the wavelength conversion portion. In the wavelength conversionmember arrangement step, the wavelength conversion member is arranged onor above the light emitting element that is mounted on the supportmember. In the light-transmissive member arrangement step, thelight-transmissive member is arranged on or above the support member soas to cover a part of the light-transmissive portion and the sidesurface(s) of the light emitting element. In the light reflection memberarrangement step, the light reflection member is arranged on or abovethe support member so as to cover the side surfaces of the wavelengthconversion member and the light-transmissive member.

According to a method for manufacturing a light emitting device ofanother embodiment of the present invention, a bonding member formationstep can be further included. In the bonding member formation step, abonding member is formed that bonds the wavelength conversion member tothe light emitting element by applying a light-transmissive bondingmaterial between the wavelength conversion member and the light emittingelement that is mounted on the support member, and spreading thelight-transmissive bonding material so that a part of thelight-transmissive bonding material covers the part of thelight-transmissive portion and the side surface(s) of the light emittingelement. In this case, the wavelength conversion member can be bondedonto the light emitting element simultaneously with thelight-transmissive member arrangement step. Therefore, the number ofsteps can be reduced in the method for manufacturing a light emittingdevice.

According to a method for manufacturing a light emitting device ofanother embodiment of the present invention, the wavelength conversionmember preparation step can includes a light-transmissive memberpreparation step and a recessed part filler step. In thelight-transmissive member preparation step, a light-transmissive membermaterial that has a recessed part(s) is prepared. In the recessed partfiller step, the recessed part(s) is/are filled with a materialincluding the phosphor whereby forming the wavelength conversion memberincluding the wavelength conversion portion, which includes thephosphor, and the light-transmissive portion, which is arranged aroundthe wavelength conversion portion. In this case, the wavelengthconversion member that includes the light-transmissive portion and thewavelength conversion portion can be easily formed.

According to a method for manufacturing a light emitting device ofanother embodiment of the present invention, the light-transmissivemember preparation step can include a step for preparing thelight-transmissive member material that have a plurality of recessedparts. In addition, the wavelength conversion member preparation stepcan include a step for forming a plurality of wavelength conversionmembers by dividing the light-transmissive member material into piecesso that each piece includes the wavelength conversion portion, whichincludes the phosphor, and the light-transmissive portion. Additionally,the bonding member formation step can include a step for bonding theplurality of wavelength conversion members to their corresponding lightemitting element, which is mounted on its support member.

According to a method for manufacturing a light emitting device ofanother embodiment of the present invention, the wavelength conversionmember preparation step can include a light-transmissive memberpreparation step, an opening formation step, and an opening filler step.In the light-transmissive member preparation step, thelight-transmissive member material is prepared. In the opening formationstep, an opening(s) is/are formed in the light-transmissive member. Inthe opening filler step, the opening(s) is/are filled with a materialincluding the phosphor whereby forming the wavelength conversion member.The wavelength conversion member includes the wavelength conversionportion, which includes the phosphor, and the light-transmissiveportion, which is arranged around the wavelength conversion portion.

According to a method for manufacturing a light emitting device ofanother embodiment of the present invention, the wavelength conversionmember preparation step can include a plate preparation step, a grooveformation step, and a light-transmissive resin material placement step.In the plate preparation step, a plate is prepared that is formed ofresin including the phosphor. In the groove formation step, a groove(s)is/are formed in the plate formed of the resin including the phosphor.In the light-transmissive resin material placement step, a light-transmissive resin material is placed in the groove(s) whereby forming thewavelength conversion member. The wavelength conversion member includesthe wavelength conversion portion, which includes the phosphor, and thelight-transmissive portion, which is arranged around the wavelengthconversion portion.

The following description will describe embodiments and examplesaccording to the present invention with reference to the drawings. Itshould be appreciated, however, that the embodiments and examplesdescribed below are illustrations of a light emitting device and amethod for manufacturing a light emitting device to give a concrete formto technical ideas of the invention, and a light emitting device and amethod for manufacturing a light emitting device of the invention arenot specifically limited to description below. Additionally, the sizesand the arrangement relationships of the members in the drawings areoccasionally exaggerated for ease of explanation. The same or similarmembers are provided with the same designation and the same referencenumerals, and their repeated description is omitted. In addition, aplurality of elements in the embodiments and examples of the presentdisclosure may be configured as a single element that serves the purposeof the plurality of elements, and a single element may be configured asa plurality of elements that serve the purpose of the single element.Also, the description of some of examples or embodiments may be appliedto other examples, embodiments or the like. In the followingdescription, although terms for indicating particular directions orpositions (e.g., “upper” and “lower”, “right”, “left”, and other termsincluding these terms) will be used as necessary for ease ofunderstanding the present with reference to the drawings, the technicalscope of the present invention is not limited by these terms. The term“comprising” a member used in this specification means that the membermay be either a separate member or a unitary member.

First Embodiment

A light emitting device 100 according to a first embodiment of thepresent invention is now described with reference to FIGS. 1 to 7 . FIG.1 is a perspective view showing the light emitting device 100 accordingto the first embodiment of the present invention. FIG. 2 is a plan viewshowing the light emitting device 100 according to the first embodimentof the present invention. FIG. 3 is a plan view showing the lightemitting device 100 of FIG. 2 with lower members being shown by dashedlines. FIG. 4 is an exploded perspective view showing the light emittingdevice 100 shown in FIG. 1 . FIG. 5 is an exploded perspective viewshowing the light emitting device 100 shown in FIG. 1 as viewed from thebottom side. FIG. 6 is a cross-sectional view showing the light emittingdevice 100 shown in FIG. 2 taken along the line VI-VI. FIG. 7 is across-sectional view schematically showing the travelling directions oflight in the view of FIG. 6 . The illustrated light emitting device 100includes a support member 1, a light emitting element 10, a wavelengthconversion member 20, and a light reflection member 40. The lightemitting element 10 is mounted on the support member 1. The wavelengthconversion member 20 is arranged on the upper surface of the lightemitting element 10. The light reflection member 40 is spaced away fromthe side surfaces of the wavelength conversion member 20 and the lightemitting element 10, and is arranged on the support member 1. A sealingmember 50 is arranged on the upper surface of the wavelength conversionmember 20. The sealing member 50 includes a hemispherical lens portion51 and a flange portion 52. The hemispherical lens portion 51 has acircular shape as viewed in a plan view and a semicircular shape asviewed in a cross-sectional view. The flange portion 52 protrudes fromthe outer periphery of the lens portion 51. The circular shape of thelens portion 51 as viewed in a plan view can be seen in FIGS. 1 to 3 .The semicircular shape as viewed in a cross-sectional view can be seenin FIGS. 4 to 6 . The flange portion 52 protrudes outward from the outerperiphery of the lens portion 51.

The wavelength conversion member 20 is larger than the light emittingelement 10 as viewed in a plan view, as shown in FIG. 3 . The wavelengthconversion member 20 includes a wavelength conversion portion 24 that isarranged on the upper surface of the light emitting element 10, and alight-transmissive portion 26 that is arranged around the wavelengthconversion portion 24, as shown in the cross-sectional view of FIG. 6 .The light emitting device further includes a light-transmissive member30 that is arranged between the light reflection member 40 and the sidesurfaces of the light emitting element 10, and is in contact with a partof the light-transmissive portion 26 of the wavelength conversion member20 and the side surfaces of the light emitting element 10.

According to this arrangement, space is formed that extends from theside surfaces of the light emitting element 10 to the side surfaces ofthe wavelength conversion portion 24, and is occupied by thelight-transmissive member 30 and the light-transmissive portion 26 ofthe wavelength conversion member 20 so that light from the lightemitting element 10 can pass through the light-transmissive member 30and the light-transmissive portion 26 without its wavelength beingconverted by the wavelength conversion portion 24. As a result, colorunevenness on the periphery of the wavelength conversion portion 24 canbe reduced that has been a problem in conventional light emittingdevices including such a wavelength conversion portion. Because thecolor unevenness can be reduced based on the principle that does not usediffusion, luminous flux reduction can be prevented. Therefore, thecolor unevenness can be improved without luminous flux reduction.

(Light-Transmissive Member 30)

The light-transmissive member 30 includes a light-transmissive bondingmember 32 that is interposed between the light emitting element 10 andthe wavelength conversion member 20. The light-transmissive bondingmember 32 can also serve as a bonding material for bonding thewavelength conversion member 20 to the light emitting element 10. A partof the light-transmissive bonding member 32 may extend from theinterface between the light emitting element 10 and the wavelengthconversion member 20 to the peripheral part defined by the side surfacesof the light emitting element 10 and a main surface of the wavelengthconversion member 20. The main surface of the wavelength conversionmember 20 is located on the light emitting element 10 side. Thelight-transmissive bonding member 32 can have a roughly invertedtriangular shape that expands toward the light-transmissive portion 26as viewed in a cross-sectional side view as shown in FIG. 6 .

Although the light emitting device is shown in the exploded perspectiveviews of FIGS. 4 and 5 for ease of understanding, the components are notnecessarily detachable. The light emitting device can be formed bycuring previously softened materials, and such a light emitting devicefalls within the scope of the present invention. That is, the lightemitting device according to the present invention is not limited to alight emitting device that can be taken apart into the illustratedcomponents.

(Light Distribution Color Unevenness)

Generally, there is likely to be a trade-off between the increase in theluminous flux of the light emitting device and the increase of the lightdistribution color unevenness. For example, the case is considered wherea blue LED as the light emitting element is used together with a platethat includes a YAG phosphor to be excited by blue light and emit yellowlight as the wavelength conversion member. The plate that includes theYAG phosphor has a larger area than the blue LED, and is arranged on theupper surface of the blue LED. A light reflection member covers the sidesurfaces of the plate that includes the YAG phosphor. Color-mixed whitelight can be thus emitted by mixing the blue light emitted by the blueLED and the yellow light converted in wavelength by the wavelengthconversion member. In such an arrangement, if the luminous flux of theblue LED is increased, so-called a yellow ring will appear in whichlight on the peripheral part of the wavelength conversion member isperceived yellowish white relative to the central part. This is causedby the optical path length difference. In the central part of thewavelength conversion member, because the length of a path of light isshorter, the blue light component will be relatively high. In theperipheral part of the wavelength conversion member, because the lengthof a path of light is longer, the yellow light component will berelatively high. Such light distribution color unevenness is increasedby increasing the output (i.e., luminous flux) of the light emittingelement. If the luminous flux is reduced, the light distribution colorunevenness can be reduced but the output is reduced. For this reason,the luminous flux is adjusted in consideration of the trade-off betweenthem in such conventional light emitting devices.

Contrary to such conventional light emitting devices, the light emittingdevice 100 according to this embodiment intentionally increases leakageof light emitted by the light emitting element 10 on the outer peripheryof the wavelength conversion member 20. As a result, the increase of thewavelength-converted light (yellow light in the illustrated lightemitting device) that is emitted by the wavelength conversion member 20can be reduced. Therefore, large color unevenness can be prevented evenif the luminous flux is increased. Specifically, as shown in FIG. 7 ,around the side surface of the light emitting element 10, a path isprovided that allows the light emitted by the light emitting element 10to pass through the light-transmissive portion 26 and go out withoutpassing through the wavelength conversion portion 24 in the wavelengthconversion members 20. This path can provide a relatively largecomponent of non-converted light around the edges of the wavelengthconversion portion 24. Consequently, the color unevenness that appearsin a light emitting device according to a comparative example having thestructure used in the conventional light emitting devices can bereduced.

FIGS. 8 and 9 show the simulation result of the light distribution colorunevenness of the light emitting devices 800 and 100 according to thecomparative example and the first embodiment, respectively. It is foundthat color unevenness appears in which the yellow component is higharound the light emitting device 800 according to the comparativeexample as shown in FIG. 8 , but such color unevenness is reduced on theperipheral part of the light emitting device 100 according to the firstembodiment as shown in FIG. 9 .

The wavelength conversion portion 24 is dimensioned larger than thelight emitting element 10 as viewed in a plan view so that the lightemitting element 10 is not exposed from the wavelength conversionportion 24 when the light emitting element 10 is placed on and bonded tothe wavelength conversion portion 24 as discussed above. In other words,because the light emitting element 10 is not exposed from the wavelengthconversion portion 24 as viewed in a plan view, the light emitted by thelight emitting element 10 is prevented from directly going out withoutreflection and the like. As a result, color unevenness caused by suchdirect outgoing light can be prevented. That is, the light emitted bythe light emitting element 10 does not directly go out but is reflectedby the light reflection member 40 and then exits as indirect light asshown in FIG. 7 , etc. As a result, the color unevenness can beprevented in which blue light is perceived around the wavelengthconversion portion 24. If color unevenness is large due to the output ofthe light emitting element, the thickness of the wavelength conversionportion, and the like, the wavelength conversion portion may be smallerthan the light emitting element as viewed in a plan view so that a partof the light emitted by the light emitting element directly exits. Thistype of light emitting device is shown as a light emitting device 100′according to a modified embodiment in a plan view of FIG. 10 . In themodified embodiment, the light-transmissive member that provides thepath to allow the light emitted by the light emitting element 10′ to goout without passing the wavelength conversion portion 24′ may beomitted. The components according to the modified embodiment shown inFIG. 10 similar to the foregoing first embodiment are attached with thesame reference signs as the first embodiment, and their description isomitted.

(Support Member 1)

The support member 1 holds the light emitting element 10, the sealingmember 50 and the like on its upper surface. The support member 1includes an electrically insulating base material, and anelectrically-conducting member 2 such as a circuit pattern onto whichthe light emitting element 10 is mounted. The electrically-conductingmember 2 is formed on the surface of the base material. Examples of theelectrically insulating base material for the support member 1 can beprovided by ceramics, resins (including resins containing reinforcementssuch as glass epoxy resin), and the like. Examples of a material forceramic mounts can be provided by alumina, aluminum nitride, mullite,and the like. Examples of such resins can be provided by thermosettingresins (e.g., epoxy resin, silicone resin, BT resin, polyimide resin,etc.), and thermoplastic resins, (e.g., polyphthalamide resin, nylonresin, etc.). The base material has a single layer or laminated layers.Aluminum nitride is used as the base material in the embodiment shown inFIG. 6 , etc. Generally, aluminum nitride has higher heat dissipatingperformance than resins. For this reason, in the case in which aluminumnitride is used for the base material, the heat dissipating performanceof the light emitting device can be improved. In addition, the basematerial may include a coloring agent, a filler, reinforcements, or thelike known in the art. Materials with good reflectance are preferablyused as the coloring agent. In particular, white materials such astitanium oxide and zinc oxide are more preferably used. Examples of thefiller can be provided by silica, alumina, and the like. The examples ofthe reinforcements can be provided by glass, calcium silicate, potassiumtitanate, and the like.

The electrically-conducting member 2 is formed on the upper and lowersurfaces of the support member 1 as required. The circuit pattern isformed by the electrically-conducting member 2. The light emittingelement 10 is mounted on the circuit pattern. An electrically-conductingmember pair 2 is formed on the back surface of the support member 1 inthe embodiment shown in FIG. 6 , etc. Electrodes that are formed on thelight emitting element 10 are connected to the electrically-conductingmember pair 2 of the support member 1 by bumps or the like in aflip-chip mounting manner. It is noted that although the light emittingelement 10 has been illustratively described to be connected in aflip-chip mounting manner to the support member 1 in the embodimentshown in FIG. 6 , etc., the present invention is not limited to this.The light emitting element can be connected by wire bonding, forexample, to the support member.

(Light Emitting Element 10)

The light emitting element 10 has a first surface 11 (lower surface inFIG. 6 ) as mount surface on which the electrodes of the light emittingelement are formed, and a second surface 12 (upper surface in FIG. 6 )as light emitting surface that is opposite to the first surface 11 ofthe light emitting element.

In the case in which, as the light emitting element 10, a semiconductorlight emitting element that includes nitride group semiconductors(In_(x)Al_(y)Ga_(1-x-y)N where x and y satisfy 0≤x, 0≤y, x+y≤1) is used,a highly efficient and stable light emitting device that has highoutput-input linearity and high mechanical shock resistance can beprovided.

The light emitting element 10 that has a rectangular shape in a planview has been illustratively described in the embodiment shown in FIGS.4, 5 , etc. However, the shape of the light emitting element 10 in thepresent invention is not limited to this. The light emitting element mayhave a square, rectangle, as well as polygonal shape such as hexagon andoctagon, circular or oval shape, or the like, for example.

(Wavelength Conversion Member 20)

The wavelength conversion member 20 shown in FIG. 6 or the like includesthe wavelength conversion portion 24 and the light-transmissive portion26. The wavelength conversion member 20 is arranged on the upper surfaceof the light emitting element 10, and converts the wavelength of lightemitted through the second surface 12 of the light emitting element 10into a different wavelength. For example, in the case in which the lightemitting element 10 emits blue light, the blue light can be converted inwavelength to yellow light whereby emitting white light by mixing theblue light and the yellow light. This wavelength conversion member 20has a first surface 21 (lower surface in FIG. 6 ), and a second surface22 (upper surface in FIG. 6 ) opposite to the first surface 21. Thefirst surface 21 of the wavelength conversion member 20 has a largerarea than the second surface 12 of the light emitting element. Accordingto this arrangement, the entire surface of the second surface 12 of thelight emitting element, i.e., the light emitting surface of the lightemitting element 10 can be covered by the wavelength conversion member20. In other words, color unevenness can be reduced caused by light thatis emitted by the light emitting element 10 (for example, blue light)and directly exits without mixed with wavelength-converted light if apart of the light emitting surface of the light emitting element 10 isnot covered by the wavelength conversion member 20. In the embodimentshown in FIG. 3 , a rectangular wavelength conversion member 20 that isslightly larger than a rectangular light emitting element 10 is used.

The wavelength conversion portion 24 of the wavelength conversion member20 can be constructed of a plate that is formed of resin including aphosphor. The phosphor can be uniformly distributed in the resin, orlocally distributed in a part of the resin. The phosphor is excited bylight emitted by the light emitting element 10, and emits luminescentradiation with a longer wavelength than the light emitted by the lightemitting element 10.

The wavelength conversion member is not limited to this. The wavelengthconversion member may be constructed of a transparent glass plate or thelike that includes a wavelength conversion portion including a phosphoron its one surface. Such a wavelength conversion portion including thephosphor on the glass plate preferably has a uniform thickness. Forexample, the phosphor may be printed on the glass plate. According tothis wavelength conversion portion, the thickness of the phosphor can besubstantially uniform. As a result, the optical path length of lightthat passes through the phosphor can be fixed. Therefore, colorunevenness and a yellow ring phenomenon can be suppressed. Instead ofprinting, a phosphor sheet may be constructed by forming a phosphor intoa sheet shape, and be applied onto a glass plate. The material of theglass plate can be selected from borosilicate glass and silica glass,for example.

The wavelength conversion portion that includes a phosphor in thewavelength conversion member 20 preferably has a thickness not smallerthan 20 μm and not greater than 500 μm. If the wavelength conversionmember 20 has a thickness greater than 500 μm, its heat dissipatingperformance is likely to decrease. From the viewpoint of heatdissipating performance, it is preferable that the thickness of thewavelength conversion member 20 is minimized. However, if the thicknessis smaller than 20 μm, the expected chromaticity range of light islikely to be narrow.

The wavelength conversion portion that includes a phosphor in thewavelength conversion member 20 can be constructed of a single layer ormultilayer. In the case in which two or more wavelength conversionlayers formed of different phosphors, it is preferable that a firstwavelength conversion layer including a red phosphor is arranged on thesecond surface 12 of the light emitting element 10, and a secondwavelength conversion layer including a yellow phosphor is arranged onthe first wavelength conversion layer. According to this arrangement,the light extracting efficiency of the light emitting device can beimproved.

(Phosphor)

Any phosphor that can be excited by light emitted by the light emittingelement 10 can be used. Examples of a phosphor that can be excited by ablue or ultraviolet light emitting element can be provided by yttriumaluminum garnet group phosphor activated by cerium; lutetium aluminumgarnet group phosphor activated by cerium; silicate group phosphoractivated by europium; β-SIALON phosphor, nitride group phosphor;fluoride group phosphor activated by manganese; sulfide group phosphor,quantum dot phosphor, and the like. Various colors of light emittingdevices (for example, white light emitting device) can be produced byusing these phosphors and a blue or ultraviolet light emitting element.

(Bonding Member 32)

The bonding member 32 is interposed between the light emitting element10 and the wavelength conversion member 20, and bonds them to eachother. The bonding member 32 can be formed of a transparent resin. Thebonding member 32 has higher transmittance than the light reflectionmember 40 for light from the light emitting element 10. The bondingmember 32 can be formed of a resin that can bond the first surface 21 ofthe wavelength conversion member 20 to the second surface 12 of thelight emitting element, for example, dimethyl group resin, phenyl groupresin, diphenyl group resin, or the like.

(Inclined Surface 31)

A part of the material of the bonding member 32 that is not cured willoverflow from the interface between the first surface 21 of thewavelength conversion member 20 and the second surface 12 of the lightemitting element, and reach the side surfaces of the light emittingelement 10. That is, the bonding member 32 will be continuously formedto the side surfaces of the light emitting element 10 from the interfacebetween the first surface 21 of the wavelength conversion member 20 andthe second surface 12 of the light emitting element, and extend from aperipheral edge part 21 b of the first surface 21 of the wavelengthconversion member 20 to the first surface 11 of the light emittingelement. As a result, as shown in the cross-sectional view of FIG. 6 ,an inclined surface 31 can be formed from the first surface 21 of thewavelength conversion member 20 to the first surface 11 of the lightemitting element.

The peripheral edge part 21 b of the first surface 21 of the wavelengthconversion member 20, refers to the peripheral part of the first surface21 (which faces the second surface 12) of the wavelength conversionmember 20 that is arranged around the light emitting element. Becausethe wavelength conversion member 20 is slightly larger than the lightemitting element 10, the first surface 21 of the wavelength conversionmember 20 includes the peripheral edge part 21 b that does not overlapthe second surface 12 of the light emitting element as viewed in a planview. For example, in the manufacturing processes of the light emittingdevice, when the light emitting element 10 and the wavelength conversionmember 20 are bonded by an uncured material of the bonding member 32,the uncured material of the bonding member 32 overflows from theinterface between the first surface 21 of the wavelength conversionmember 20 and the second surface 12 of the light emitting element and isforcedly moved toward the peripheral edge part 21 b of the first surface21 of the wavelength conversion member 20. After that, the uncuredmaterial moves down along the side surfaces of the light emittingelement 10. As a result, the inclined surface 31 is formed from thefirst surface 21 of the wavelength conversion member 20 to the firstsurface 11 of the light emitting element.

(Light Reflection Member 40)

The light reflection member 40 serves to cover the bonding member 32 andthe wavelength conversion member 20. Suitable example of a resinmaterial for forming the light reflection member 40 can be provided bylight-transmissive resins such as silicone resin, dimethyl siliconeresin, phenyl silicone resin, epoxy resin, and phenol resin, and thelike. In order to efficiently reflect light emitted by the lightemitting element 10, the light reflection member 40 is preferably formedof a resin with high reflectance. For example, the light reflectionmember can be formed a light-transmissive resin in which alight-reflecting substance is dispersed. Suitable examples of thelight-reflecting substance can be provided by titanium oxide, siliconoxide, zirconium oxide, potassium titanate, aluminum oxide, aluminumnitride, boron nitride, mullite, and the like. Granular, fibrous, andstrip-shaped light-reflecting substances can be used. In particular,fibrous substances are preferably used because they are expected toreduce the thermal expansion coefficient of the light reflection member.The light reflection member 40 has reflectance not smaller than 70% forthe light emitted by the light emitting element 10. According to this,light that is incident on the light reflection member 40 can bereflected, and directed toward the second surface 22 of the wavelengthconversion member 20. As a result, the light extracting efficiency ofthe light emitting device can be increased.

The light reflection member 40 is preferably in contact with the sidesurfaces of the wavelength conversion member 20 so as to cover the sidesurfaces. According to this arrangement, the light emitting device canhave high contrast between the light emission area and non-lightemission area. In addition, the light reflection member 40 is preferablyarranged between the first surface 11 of the light emitting element andthe supporting member 1. According to this arrangement, light emitted bythe light emitting element 10 is reflected by the light reflectionmember 40 arranged between the first surface 11 of the light emittingelement and the supporting member. As a result, absorption by thesupporting member can be suppressed. It is preferable that the lightreflection member 40 has an inclined part that is inclined from theperipheral edges of the wavelength conversion member 20 toward theperipheral edges of the light emitting element so that the thickness ofthe light reflection member 40 becomes thinner toward the peripheraledges of the light emitting element. According to this arrangement, inthe case in which the light emitting device includes the sealing member50 that covers the wavelength conversion member 20 and the lightreflection member 40, the height of the lower surface of the sealingmember 50 in the peripheral edges of the light emitting device can below. Therefore, the light emitting device can be thin.

It is preferable that the upper surface of the light reflection member40 is positioned higher than the upper surface of the wavelengthconversion member 20. According to this arrangement,wavelength-converted light and light emitted by the light emittingelement 10 can be effectively incident on and reflected by the interiorsurfaces of the wavelength conversion member 20.

(Sealing Member 50)

The sealing member 50 is arranged on the upper surface of the wavelengthconversion member 20, as shown in FIGS. 2, 6 , etc. The sealing member50 includes the hemispherical lens portion 51 and the flange portion 52.The hemispherical lens portion 51 has a circular shape as viewed in aplan view and a semicircular shape as viewed in a cross-sectional view.The flange portion 52 protrudes from the outer periphery of the lensportion 51. The sealing member 50 can be formed of a transparent sealingmaterial. Light-transmissive resins, glass, or the like can be used forthe sealing member 50. In particular, light-transmissive resins arepreferably used. Examples of the light-transmissive resins can beprovided by thermosetting resins (e.g., silicone resin, epoxy resin, andphenol resin), and thermoplastic resins (e.g., polycarbonate resin andacrylate resin). In particular, a silicone resin that has good lightresistance and heat resistance is preferably used. Various kinds offillers may be included in the sealing member 50 for purpose ofviscosity adjustment and the like.

However, the sealing member is not essential. A light emitting device400 according to modified embodiment shown in FIG. 11 does not includethe sealing member. For example, such a light emitting device issuitably used for non-light-gathering devices (which do not need a lensportion) or the like.

In addition, the light emitting device 100 can include a protectionelement that protects the light emitting element 10 from damage causedby overcurrent. The protection element can be embedded in the lightreflection member 40. Examples of the protection element can be providedby Zener diode, capacitor, and the like. The protection elementpreferably includes electrodes on its one surface, because it can bemounted in a facedown manner without wire.

Second Embodiment

The light reflection member 40 according to the foregoing firstembodiment has been illustratively described to have a box shape havingflat interior vertical walls as shown in FIG. 4 , etc. Also, the lightreflection member 40 according to the first embodiment has beenillustratively described to have the inclined surfaces under theinterior vertical walls as shown in the cross-sectional view of FIG. 6 .It is noted that the light reflection member according to the presentinvention is not limited to this. The light reflection member may have astraight-line or intersecting-straight-line shape, or the like as viewedin a cross-section. Alternatively, the light reflection member may havea curved-line shape as viewed in a cross-section. This type of lightemitting device 200 according to a second embodiment is now describedwith reference to FIGS. 12 to 14 . FIG. 12 is a perspective view showingthe light emitting device 200 according to the second embodiment withits sealing member being removed. FIG. 13 is an exploded perspectiveview showing the light emitting device 200 shown in FIG. 12 . FIG. 14 isa cross-sectional view showing the light emitting device 200 accordingto the second embodiment. The illustrated light emitting devices 200includes a light reflection member 40B that has a concave shape. Lightemitted by the light emitting element 10 is reflected at continuouslyvarying angles by the curved inclined surface of the light reflectionmember 40B shown in the cross-sectional view of FIG. 14 . As a result,it is possible to reduce luminance unevenness caused by reflected lightgathering a certain direction. Although the light reflection membershown in FIG. 4 has a rectangular box shape, the light reflection membershown in FIGS. 12 and 13 has a cylindrical shape. According to thisarrangement, reflected light can be prevented from gathering in thecorners defined by the neighboring sides of the rectangular shape. As aresult, luminance unevenness can be reduced in a plan view as comparedwith the rectangular box shape.

The gap d2 between the end surface of the wavelength conversion portion24 and the interior wall of the light reflection member 40B according tothe embodiment shown in FIG. 14 is dimensioned larger as compared withthe gap d1 between the end surface of the light emitting element 10 andthe interior vertical wall of the light reflection member 40 accordingto the embodiment shown in FIG. 6 . The gap d2 can increasenon-converted light (emitted by the light emitting element 10 and notconverted by the wavelength conversion portion 24) that exits from thelight emitting device. As a result, light distribution color unevennesscan be further improved.

(Light-Transmissive Portion 26)

The light-transmissive portion 26 is formed at least around thewavelength conversion member 20. Because the light-transmissive portion26 is arranged around the wavelength conversion portion 24, lightemitted by the light emitting element 10 can pass through thelight-transmissive portion 26 without converted by the wavelengthconversion portion 24. That is, the component of light emitted by thelight emitting element 10 can be relatively increased around thewavelength conversion portion 24. If the light emitting device accordingto the embodiment shown in FIG. 7 is considered as a light emittingdevice that includes a blue LED as the light emitting element 10 and ayellow phosphor (e.g., YAG) as the wavelength conversion portion 24, andcan emit white light by mixing blue light and yellow light, althoughwhite light can be obtained near the central part of the wavelengthconversion portion 24, the amount of yellow light component tends toincrease toward the periphery of the wavelength conversion portion 24relative to blue light component in light emitted from the lightemitting device. The reason is that the optical path length of the lightreflected or scattered by the wavelength conversion portion 24 becomeslonger toward the central part. For this reason, blue light that is notconverted in wavelength is led to pass by the side surfaces of thewavelength conversion portion 24 so that the chromaticity is adjusted.As a result, such light distribution color unevenness can be reduced.

In although the light-transmissive portion 26 is preferably arrangedaround the wavelength conversion member 20, the light-transmissiveportion is allowed to be partially absent as long as light distributioncolor unevenness is acceptable. The light-transmissive portion may bearranged near the corners of a rectangular light emitting element wherelight distribution color unevenness is likely occur, while thelight-transmissive portion may be absent in the rest parts around therectangular light emitting element, for example.

The light-transmissive portion 26 is arranged not only around thewavelength conversion portion 24 but also on the upper surface of thewavelength conversion portion 24 so as to continuously cover thewavelength conversion portion 24 in the embodiment shown in FIG. 6 ,etc. This arrangement has an advantage in terms of the manufacturingprocess that the light-transmissive portion 26 can be easily formedaround the wavelength conversion portion 24. However, even if thelight-transmissive portion 26 is not formed on the upper surface of thewavelength conversion portion 24, the light distribution colorunevenness reduction effect can be still provided. For this reason, thelight-transmissive portion on the upper-surface side may be omitted. Forexample, the light-transmissive portion on the upper-surface side can beremoved by grinding or the like after the light-transmissive portion isformed. This type of light emitting device to a third embodiment is nowdescribed with reference FIG. 15 . In this embodiment, the upper surfaceof the wavelength conversion portion 24 is covered not by thelight-transmissive portion 26 but by the sealing member 50 so that thesealing member 50 protects the surface of the wavelength conversionportion 24.

The light-transmissive portion 26 included in the wavelength conversionmember 20 may be integrally formed with the sealing member 50. Althoughthe space between the side surface of the light emitting element 10 andthe inclined surfaces of the light reflection member 40 is filled withthe light-transmissive member 30 in the first embodiment as shown in thecross-sectional view of FIG. 6 , the present invention is not limited tothis. That is, the light-transmissive member 30 may have a roughlyinverted triangular shape that extends from the side surfaces of thelight emitting element 10 to the back-surface side of the wavelengthconversion portion 24, and the light-transmissive portion 26 may extendto the side surfaces of this light-transmissive member 30 as shown inthe cross-sectional view of FIG. 14 . It should be noted that FIG. 14shows an exemplary configuration in which the light-transmissive portion26 is integrally formed with the sealing member 50. According to thisarrangement, the interface between the light-transmissive member 30 andthe light-transmissive portion 26 shown in FIG. 14 is inclined, that is,extends in a slanting direction from the lower end of the wavelengthconversion portion 24 so that the light-transmissive portion 26 catchesthe light-transmissive member 30. As a result, the connection strengthbetween the light-transmissive portion 26 and the light-transmissivemember 30 can be improved as compared with the embodiment shown in thecross-sectional view of FIG. 6 where the interface between thelight-transmissive member 30 and the light-transmissive portion 26 liesin a horizontal plane. It is noted that the gap d2 between thewavelength conversion portion 24 and the light reflection member 40B isnot necessarily filled with the light-transmissive portion 26 or thelike. The gap d2 may be partially or entirely remain hollow. In thiscase, the luminous flux of the light emitting device can be improved.

(Manufacturing Method of Light Emitting Device 100 of First Embodiment)

A method for manufacturing the light emitting device 100 according tothe first embodiment is now described with reference to FIGS. 16 to 20 .The wavelength conversion member 20 that includes the wavelengthconversion portion 24 that includes a phosphor is prepared, and thelight-transmissive portion 26 that is arranged around the wavelengthconversion portion 24. For example, a light-transmissive portionmaterial 26 b that has a plurality of recessed parts 26 c spaced awayfrom each other, as shown in FIG. 16 , is prepared. Thelight-transmissive portion material 26 b is a material from which thelight-transmissive portions 26 can be obtained. A material sheet made ofa light-transmissive resin (e.g., a sheet of silicone resin) can be usedas the light-transmissive portion material 26 b, for example. Thelight-transmissive portion material 26 b is not limited to a materialsheet of resin. A glass sheet may be used. The recessed parts 26 c canhave a circular, elliptical, or rectangular shape as viewed in a planview.

Subsequently, the recessed parts 26 c are filled with resin 24 b thatincludes a phosphor (phosphor-containing resin material 24 b) forforming the wavelength conversion portion 24 as shown in FIG. 17 . Thesheet of silicone resin is divided into blocks as shown in FIG. 18 .Thus, individual blocks 27 for the wavelength conversion member 20 areobtained.

Subsequently, the wavelength conversion member 20 is arranged on thelight emitting element 10 that is arranged on the support member 1 thatis previously prepared. The light emitting element 10 is mounted in aflip-chip mounting manner on the support member 1. The light emittingelement 10 is formed smaller than the wavelength conversion member 20 asviewed in a plan view. The individual block 27 is turned upside down sothat the phosphor (i.e., the wavelength conversion portion 24) islocated on the lower-surface side, and the wavelength conversion member20 is placed on the upper surface of this support member 1, as shown inFIG. 19 . After this placement, the light-transmissive member 30 isarranged on the support member 1 so as to cover a part oflight-transmissive portion 26 and the side surfaces of the lightemitting element 10. To this end, a light-transmissive bonding materialis applied to a surface that will be the interface between the uppersurface of the light emitting element 10 and the wavelength conversionportion 24. After that, when the wavelength conversion portion 24 isplaced on the upper surface of the light emitting element 10, thebonding material will overflow from the interface and be forcedly movedfrom the side surfaces of the light emitting element 10 toward theperipheral part of the wavelength conversion member 2. The bondingmaterial adheres to the part from the side surfaces of the lightemitting element 10 to the peripheral part of the wavelength conversionmember 2, and is cured into a fillet shape. A material similar to thesealing member 50 (e.g., silicone resin or epoxy resin) can be suitablyused for the light-transmissive bonding material. The light-transmissivemember 30 can be formed of a part of the bonding material that overflowsfrom the interface. Alternatively, a light-transmissive material can beadditionally provided as the light-transmissive member 30 between theside surfaces of the light emitting element 10 and the light reflectionmember 40.

In addition, the light reflection member 40 is arranged on the supportmember 1. In this embodiment, as shown in FIG. 20 , white resin isformed on the peripheral part of the upper surface of the support member1 so as to cover the side surfaces of the wavelength conversion member20 and the light-transmissive member 30.

Finally, the sealing member 50 is placed on the upper surfaces of thewavelength conversion member 20 and the light reflection member 40. Thelight emitting device 100 shown in the cross-sectional view of FIG. 6can be manufactured by these processes.

(Manufacturing Method of Light Emitting Device 300 of Third Embodiment)

A method for manufacturing a light emitting device 300 according to thethird embodiment is now illustratively described with reference to FIGS.21 to 30 . A light-transmissive portion material 26 d shown in FIG. 21is first prepared. Similar to the light-transmissive portion material 26b, the light-transmissive portion material 26 d is a material from whichthe light-transmissive portions 26 can be obtained. A material sheetmade of a light-transmissive resin (e.g., a sheet of silicone resin) canbe used as the light-transmissive portion material 26 d, for example.

Subsequently, openings 26 e are formed in the light-transmissive portionmaterial 26 d as shown in FIG. 22 . The openings 26 e have apredetermined size and are spaced away at a fixed interval from eachother in the sheet-shaped light-transmissive portion material 26 d. Theopenings 26 e can have a shape selected from circular, elliptical,rectangular and polygonal shapes, and the like. In this embodiment, theopenings 26 e have a circular shape as shown in a perspective view ofFIG. 23 . For example, the openings 26 e are formed by punching or thelike.

Subsequently, each opening 26 e in the light-transmissive portionmaterial 26 d accommodates the wavelength conversion portion 24 as shownin FIG. 24 . In this embodiment, each opening 26 e is filled with aresin material 24 c that includes a phosphor (phosphor-containing resinmaterial 24 c). The wavelength conversion portion 24 is formed by curingthe resin material 24 c. The process for filling the opening 26 e withthe phosphor-containing resin material 24 c can be selected fromapplication by printing, potting, spraying, and the like.

After curing the phosphor-containing resin material 24 c, as shown inFIG. 25 , the light-transmissive portion material 26 d is divided intoblocks with a predetermined size. Dicing or the like can be used for thedivision process. The blocks 27 b obtained by the division can have anyshape such as rectangular or polygonal shape, or the like. In thisembodiment, the blocks 27 b have a square shape as shown in aperspective view of FIG. 26 . Each block 27 b includes thephosphor-containing resin material 24 c after the division process bycutting. Although each block 27 b includes one phosphor-containing resinmaterial 24 c part after the cutting in this embodiment, each block mayinclude two or more phosphor-containing resin material 24 c parts afterthe cutting. Each block 27 b obtained as discussed above forms thewavelength conversion member 20 that includes the light-transmissiveportion 26 arranged around the wavelength conversion portion 24.

Subsequently, each block 27 b is bonded onto the light emitting element10. In this embodiment, the light emitting element 10 is previouslymounted on the support member 1 as shown in FIG. 27 . In thisembodiment, the light emitting element 10 is mounted in a flip-chipmounting manner on the support member 1. Also, the light emittingelement 10 is preferably smaller than the wavelength conversion member20 as viewed in a plan view. Each block 27 b is bonded to the uppersurface of the support member 1 by using a light-transmissive bondingmaterial. The light-transmissive bonding material is applied to one ofor both of the upper surface of the light emitting element 10 and thelower surface of the block 27 b between which the interface is formed.After that, when the block 27 b is placed on the upper surface of thelight emitting element 10, the bonding material will overflow from theinterface of the light emitting element 10 and spread around the lightemitting element 10. The overflowing bonding material extends from theside surfaces of the light emitting element 10 to the peripheral part ofthe lower surface of the block 27 b. As a result, the bonding materialis formed into a fillet shape the cross-sectional configuration of whichis roughly inverted triangular as shown in FIG. 27 . Thelight-transmissive member 30 is formed by curing the light-transmissivebonding material. A material similar to the sealing member 50 (e.g.,silicone resin, epoxy resin, etc.) can be suitably used for thelight-transmissive bonding material as discussed above.

In addition, the light reflection member 40 is arranged on the supportmember 1. In this embodiment, as shown in FIG. 28 , a white resinmaterial that includes a filler material is placed on the upper surfaceof the support member 1 so as to cover the side surfaces of thewavelength conversion member 20 and the light-transmissive member 30.The light reflection member 40 is formed by curing the white resinmaterial.

Finally, the sealing member 50 is placed on the upper surfaces of thewavelength conversion member 20 and the light reflection member 40 asshown in FIG. 29 . The light emitting device 300 shown in a pain view ofFIG. 30 can be manufactured by these processes.

(Manufacturing Method of Light Emitting Device 400 of Fourth Embodiment)

It has been illustratively described that the light-transmissive resinmaterial sheet that will form the light-transmissive portion 26 ispreviously prepared and provided with openings, and the openings arefilled with the phosphor-containing resin material 24 c and will formthe wavelength conversion portion 24 in the method for manufacturing alight emitting device according to the third embodiment. However, amethod for manufacturing a light emitting device according to thepresent invention is not limited to this. The wavelength conversionportion can be previously prepared, and the light-transmissive portioncan be formed around the wavelength conversion portion. This type ofmethod for manufacturing a light emitting device 400 according to afourth embodiment is now described with reference to FIGS. 31 to 40 . Aresin material sheet 24 d that includes a phosphor (phosphor-containingresin material sheet 24 d) is first prepared as shown in FIG. 31 . Forexample, a sheet made of silicone resin that includes a distributedphosphor is produced as the resin material sheet 24 d.

Subsequently, grooves 26 f are formed in the phosphor-containing resinmaterial sheet 24 d as shown in FIG. 32 . In this embodiment, after thephosphor-containing resin material sheet 24 d is arranged on asupporting substrate 24 f, the grooves 26 f are formed in the resinmaterial sheet 24 d. The phosphor-containing resin material sheet 24 dis divided based on a predetermined pattern along the grooves 26 f. Inthe embodiment shown in a perspective view of FIG. 33 , the grooves 26 fare formed on a sheet made of silicone that includes a distributedphosphor to form a grid pattern. The sheet is divided into rectangularphosphor blocks 24 e. Dicing can be used to form the grooves 26 f, forexample. To hold the phosphor blocks 24 e obtained by the division, theresin material sheet 24 d is preferably placed on the supportingsubstrate 24 f, or on another sheet that serves as a jig or rest.

Subsequently, the light-transmissive portions 26 are formed around thephosphor blocks 24 e, as shown in FIG. 34 . For example, the grooves 26f are filled with light-transmissive silicone resin. Subsequently, thelight-transmissive portions 26 are formed around the phosphor blocks 24e by curing the light-transmissive silicone resin.

Subsequently, the resin material sheet 24 d that includes thelight-transmissive portions 26 is divided into blocks having apredetermined size, as shown in FIG. 35 . Each block 27 c can have anyshape such as rectangular or polygonal shape, or the like. In thisembodiment, the blocks 27 c have a square shape as shown in aperspective view of FIG. 36 . The resin material sheet is divided bycutting so that the block 27 c includes the phosphor block 24 e.Although each block 27 c includes one phosphor block 24 e after thecutting in this embodiment, each block may include two or more phosphorblocks after the cutting as stated in the foregoing embodiment. Eachblock 27 c obtained as discussed above forms the wavelength conversionmember 20 that includes the light-transmissive portion 26 arrangedaround the wavelength conversion portion 24.

Subsequently, each block 27 c is similarly bonded onto the lightemitting element 10. Also, in this embodiment, the light emittingelement 10 is previously mounted on the support member 1 as shown inFIG. 37 . Each block 27 c is bonded to the upper surface of the supportmember 1 by using a light-transmissive bonding material. The bondingmaterial will overflow from the boundary of the light emitting element10 and spread around the light emitting element 10. The overflowingbonding material extends from the side surfaces of the light emittingelement 10 to the peripheral part of the lower surface of the block 27c. As a result, the bonding material is formed into a fillet shape. Thelight-transmissive member 30 is formed by curing the light-transmissivebonding material.

Subsequently, the light reflection member 40 is arranged on the supportmember 1 as shown in FIG. 38 . Finally, the sealing member 50 isarranged on the upper surfaces of the wavelength conversion member 20and the light reflection member 40 as shown in FIG. 39 . The lightemitting device 400 shown in a plan view of FIG. 40 can be manufacturedby these processes.

A light emitting device according to the embodiments of the presentinvention can be suitably used for LED display, backlight for liquidcrystal displays or the like, light source for lighting fixtures,headlight, signal light, illuminated switch, various types of sensorsand indicators, and the like.

It should be apparent to those with an ordinary skill in the art thatwhile various preferred embodiments of the invention have been shown anddescribed, the invention is not limited to the particular embodimentsdisclosed, which are deemed to be merely illustrative of the inventiveconcepts, and which are suitable for all modifications and changesfalling within the scope of the invention as defined in the appendedclaims.

What is claimed is:
 1. A light emitting device comprising: a lightemitting element having an upper surface, a lower surface that isopposite to the upper surface, and one or more lateral surfaces; awavelength conversion member having an upper surface, a lower surface,and one or more lateral surfaces, the wavelength conversion membercomprising: a wavelength conversion portion that has an upper surface, alower surface, and one or more lateral surfaces, wherein the wavelengthconversion portion is arranged on or above the upper surface of thelight emitting element, and a light-transmissive portion that has anupper surface, a lower surface, and one or more lateral surfaces,wherein, in a plan view, the light-transmissive portion surrounds atleast the one or more lateral surfaces of the wavelength conversionportion; a sealing member comprising a lens portion that is arranged onor above the upper surface of the wavelength conversion member; and alight reflection member that surrounds the one or more lateral surfacesof the wavelength conversion member; wherein, in a plan view, thewavelength conversion member is inside a perimeter of the lens portion;wherein the wavelength conversion portion comprises a phosphor; andwherein the light-transmissive portion comprises a transparent glassplate having one surface facing the wavelength conversion portion. 2.The light emitting device according to claim 1, wherein, in a plan view,the light emitting element is within a perimeter of the wavelengthconversion portion.
 3. The light emitting device according to claim 1,wherein, in a plan view, at least a portion of the light reflectionmember is positioned between the wavelength conversion member and aperiphery of the lens portion annularly.
 4. The light emitting deviceaccording to claim 1, wherein the one or more lateral surfaces of thelight-transmissive portion form the one or more lateral surfaces of thewavelength conversion member.
 5. The light emitting device according toclaim 1, wherein a thickness of the light reflection member at aperiphery of the light emitting element is less than a thickness of thelight reflection member at a periphery of the wavelength conversionmember.
 6. The light emitting device according to claim 5, wherein thelight reflection member has an inclined part that is inclined from theperiphery of the wavelength conversion member toward the periphery ofthe light emitting element.
 7. The light emitting device according toclaim 1, wherein the sealing member comprises a flange portionprotruding outward from a periphery of the lens portion.
 8. The lightemitting device according to claim 1, wherein the upper surface of thewavelength conversion portion and the upper surface of thelight-transmissive portion form the upper surface of the wavelengthconversion member.
 9. The light emitting device according to claim 1,further comprising: a light-transmissive member that is arranged betweenthe light reflection member and the one or more lateral surfaces of thelight emitting element; wherein the light-transmissive member contacts apart of a lower surface of the light-transmissive portion of thewavelength conversion member.
 10. The light emitting device according toclaim 9, wherein the light-transmissive member contacts the one or morelateral surfaces of the light emitting element.
 11. A light emittingdevice comprising: a light emitting element having an upper surface, alower surface that is opposite to the upper surface, and one or morelateral surfaces; a wavelength conversion member having an uppersurface, a lower surface, and one or more lateral surfaces, thewavelength conversion member comprising: a wavelength conversion portionthat has an upper surface, a lower surface, and one or more lateralsurfaces, wherein the wavelength conversion portion is arranged on orabove the upper surface of the light emitting element, and alight-transmissive portion that has an upper surface, a lower surface,and one or more lateral surfaces, wherein, in a plan view, thelight-transmissive portion surrounds at least the one or more lateralsurfaces of the wavelength conversion portion; a sealing membercomprising a lens portion that is arranged on or above the upper surfaceof the wavelength conversion member; a light reflection member thatsurrounds the one or more lateral surfaces of the wavelength conversionmember; and a light-transmissive member that is arranged between thelight reflection member and the one or more lateral surfaces of thelight emitting element; wherein, in a plan view, the wavelengthconversion member is inside a perimeter of the lens portion; and whereinthe light-transmissive member contacts a part of a lower surface of thelight-transmissive portion of the wavelength conversion member.
 12. Thelight emitting device according to claim 11, wherein thelight-transmissive member contacts the one or more lateral surfaces ofthe light emitting element.
 13. The light emitting device according toclaim 11, wherein, in a plan view, the light emitting element is withina perimeter of the wavelength conversion portion.
 14. The light emittingdevice according to claim 11, wherein, in a plan view, at least aportion of the light reflection member is positioned between thewavelength conversion member and a periphery of the lens portionannularly.
 15. The light emitting device according to claim 11, whereinthe one or more lateral surfaces of the light-transmissive portion formthe one or more lateral surfaces of the wavelength conversion member.16. The light emitting device according to claim 11, wherein a thicknessof the light reflection member at a periphery of the light emittingelement is less than a thickness of the light reflection member at aperiphery of the wavelength conversion member.
 17. The light emittingdevice according to claim 16, wherein the light reflection member has aninclined part that is inclined from the periphery of the wavelengthconversion member toward the periphery of the light emitting element.18. The light emitting device according to claim 11, wherein the sealingmember comprises a flange portion protruding outward from a periphery ofthe lens portion.
 19. The light emitting device according to claim 11,wherein the upper surface of the wavelength conversion portion and theupper surface of the light-transmissive portion form the upper surfaceof the wavelength conversion member.
 20. The light emitting deviceaccording to claim 11, wherein the wavelength conversion portioncomprises a phosphor; and wherein the light-transmissive portioncomprises a transparent glass plate having one surface facing thewavelength conversion portion.